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Congratulations on the successful convening of the 17th China Copper-clad Technology & Market Seminar

Congratulations on the successful convening of the 17th China Copper-clad Technology & Market Seminar

(Summary description)On October 13,2016,the 17th China Copper-clad Technology&Market Seminar was successfully held in Didu Hotel,Xianyang city,Shaanxi Province,jointly sponsored by China Electronic Materials Industry Association Copper-clad Material Branch(CCLA)and Substrate Material Branch of China Printed Circuit Industry Association.Nearly 200 representatives from 118 units including PCB,CCL and upstream raw materials and equipment manufacturing enterprises,testing enterprises,related research institutes,colleges and universities,consulting institutions and social organizations attended the meeting

Congratulations on the successful convening of the 17th China Copper-clad Technology & Market Seminar

(Summary description)On October 13,2016,the 17th China Copper-clad Technology&Market Seminar was successfully held in Didu Hotel,Xianyang city,Shaanxi Province,jointly sponsored by China Electronic Materials Industry Association Copper-clad Material Branch(CCLA)and Substrate Material Branch of China Printed Circuit Industry Association.Nearly 200 representatives from 118 units including PCB,CCL and upstream raw materials and equipment manufacturing enterprises,testing enterprises,related research institutes,colleges and universities,consulting institutions and social organizations attended the meeting

Information
On October 13,2016,the 17th China Copper-clad Technology&Market Seminar was successfully held in Didu Hotel,Xianyang city,Shaanxi Province,jointly sponsored by China Electronic Materials Industry Association Copper-clad Material Branch(CCLA)and Substrate Material Branch of China Printed Circuit Industry Association.Nearly 200 representatives from 118 units including PCB,CCL and upstream raw materials and equipment manufacturing enterprises,testing enterprises,related research institutes,colleges and universities,consulting institutions and social organizations attended the meeting.
There are 33 papers in this symposium,17 of which were selected by the expert committee,and two venues were arranged for the conference speech exchange.
Paid attention to by the industry of high frequency copper clad in recent years,with the only before decimeter wave and centimeter-wave high frequencies is different,the symposium to datong of the millimeter wave circuit substrate material of new developments of papers,the millimeter wave substrate in recent years the rapid expansion of market and applied to the millimeter wave circuit of high frequency microwave paper discussed the technology development of type copper clad laminates,and the trend of the development,characteristics were analyzed.In the paper"dielectric Performance Test of 60 GHz Millimeter Wave",Professor Wang Hong of Microelectronics College of Xi'an Jiaotong University,called the high-frequency plate used up to 60 GHz as the next generation copper clad plate,and believed that the research on the substrate material used for millimeter wave circuit was promoting the revolutionary technological progress of high-speed copper clad plate and even the whole copper clad plate.It is believed that this seminar will play a major role in promoting the innovative development of millimeter band high-frequency substrate materials in China.
Yang Weizheng of Nanjing Institute of Electronics Technology pointed out in his paper"Current Situation and Prospect of High frequency copper-clad Laminates"that the high frequency copper-clad laminates needed for multilayer and high reliability metallization hole design and manufacturing of pure ptFE medium are not fully able to meet the market application demand at present.It seems that domestic copper clad laminate industry,in the manufacturing of multilayer printed board binder,we should not only speed up the technological innovation,but also enhance the recognition of the innovation of binder.
Industry famous expert ShiJianYing chief engineer of the design and development of thermal conductive copper clad paper,comprehensively systematically introduces the heat conduction mechanism of thermal conductive copper clad with subversive significance,choice of raw materials,thermal conductivity calculation model,formula design and composite resin adhesive solution synthesis,resin base electrical insulating thermal conductive composite dielectric materials high temperature hot pressing molding process of the preparation,thermal conductivity of copper clad laminates,and many other concerns of the industry.
In terms of new materials for high frequency copper clad laminates,the paper of"Preparation and Properties of Low dielectric main chain Benzoxazine Resin"by Dr.Zeng Ming of China University of Geosciences and"High frequency Copper clad Laminates of Low dielectric Polycarbosilane"by Professor Yang Military Academy of Southwest University of Science and Technology introduces new materials with Dk up to level 2.4.
The paper"Preparation of Surface activated Graphene and its Application in Polyimide"by Dan Wang,a graduate student of Jianghan University,is the first paper published in previous seminars on the application of graphene in the field of raw materials for copper clad laminates.
The paper by Professor Li Wenfeng of Tongji University on the Mechanism of Cyanate/Hydroxyl reaction is considered by relevant experts to be a unique in-depth study on the mechanism of cyanate/hydroxyl reaction,which is likely to play an important supporting and guiding role in relevant research.
In this paper,"Preparation and Properties of Double-sided flexible Copper clad laminates without adhesive tape",hu Qibin,engineer of National Electronic Circuit Substrate Engineering And Technology Research Center,introduced the successful process of manufacturing two-layer flexible copper clad laminates by secondary coating method.
The paper"Development of Transparent flexible PET Substrate and Covering Film"by Xu Yaxin,an engineer from Guangzhou Hongren Electronics Industry Co.,LTD.,is one of the few literatures that have introduced the manufacturing process of another kind of polyester flexible copperplate and related products in previous seminars.
Chengdu university of electronic science and technology Jason hu the epoxy resin surface chemical nickel plating technology was studied in the paper,the embedded on electromagnetic shielding and buried resistor manufacture aspect has the important application of the epoxy resin surface chemical nickel plating,explores the main salt concentration,reducing agent concentration,temperature and solution pH on the chemical plating nickel deposition rate,and the best parameters are obtained.
Shandong jinbao electronics co.,LTD Yang Xiangkui the high frequency circuit with a copper foil surface micromachining processing technology research,the paper,the successive seminar,is very suitable for ptfe is introduced for the first time,ceramic filled with hydrocarbons,polyphenylene oxide,and other high frequency printed circuit with high temperature and high extension of low coarsening processing frequently-LC electrolytic copper foil manufacturing process.It marks the great progress of domestic copper foil used in high frequency circuit.
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In short,the symposium papers not only involved in a wide range of professional fields,information,and many highlights.Participants generally said that this is a rare opportunity to obtain a lot of innovative information,benefit a lot.
The co-organizers of the workshop are as follows:China electronic electronic fine chemical and polymer materials industry association branch,China electronic materials industry association branch(CCFA),copper foil material(GPCA)circuit board industry association of guangdong province,shenzhen PCB industry association(SPCA),Taiwan PCB association(TPCA),China enterprise association of flexible copper clad laminates.The symposium has Shanghai South Asia copper-clad plate co.,LTD.,shaanxi xianyang wei di yi technology co.,LTD.,mechanical and electrical technology co.,LTD.,shandong holy stream of new materials co.,LTD.,guangdong yi technology co.,LTD.,Lin light far with new material technology co.,LTD.,guangdong yuxin materials co.,LTD.,zhuhai town east co.,LTD.,nantong natsuki TuHai machinery co.,LTD.,Shanghai industry and trade co.,LTD.,a lot of sponsorship.The organizing committee and all the representatives would like to express their heartfelt thanks to all the co-organizers and sponsors for their great support!

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