On October 13, 2016, the 17th China Copper Clad Laminate Technology Market Seminar, co-sponsored by the Copper Clad Laminate Material Branch (CCLA) of the China Electronic Materials Industry Association and the Substrate Material Branch of the China Printed Circuit Industry Association, was successfully held at the Didu Hotel in Xianyang City, Shaanxi Province. Nearly 200 representatives from 118 units including domestic and foreign PCB, CCL and upstream raw materials and equipment manufacturing companies, testing companies, related scientific research institutes, colleges and universities, consulting agencies, and social organizations attended the meeting.
A total of 33 papers were included in this seminar. After review by the expert committee, 17 papers were selected and two venues were arranged for speeches and exchanges.
In recent years, the industry generally attaches great importance to the high-frequency copper clad laminate, and the past only decimeter wave, centimeter wave high-frequency band of the situation is different, this seminar Zhu Datong high-tech "millimeter wave circuit substrate material technology for the rapid expansion of millimeter wave circuit substrate market in recent years, as well as the application of millimeter wave circuit high-frequency microwave copper clad laminate technology development, and its development trend, characteristics are analyzed. In the paper "60 GHz Millimeter Wave Dielectric Performance Test" by Professor Wang Hong from the School of Microelectronics of Xi 'an Jiaotong University, the high-frequency board used up to 60 GHz is called the next generation of copper clad laminate, and it is believed that the research on substrate materials for millimeter wave circuits is promoting the revolutionary technological progress of high-speed copper clad laminate and even the whole copper clad laminate. It is believed that this seminar will play a significant role in promoting the innovation and development of high-frequency substrate materials in millimeter wave band in China.
The paper "Current Situation and Prospect of Bonding Sheet for High Frequency Copper Clad Laminate" by Yang Weisheng Gao Gong of Nanjing Institute of Electronic Technology points out that the bonding sheet required for the design and manufacture of multi-layered and high-reliability metallized holes of high frequency copper clad laminate with pure PTFE medium cannot fully meet the market application requirements at present. It seems to suggest that the domestic copper clad laminate industry should not only speed up technological innovation in the manufacture of multi-layer printed circuit board adhesive sheets, but also enhance the re-understanding of adhesive sheet innovation.
The paper "Design and Development of Thermal Conductive Copper Clad Laminate" by Chief Engineer Jian Ying, a famous expert in the industry, comprehensively and systematically introduces the thermal conductivity mechanism, raw material selection, thermal conductivity calculation model, formula design, composite resin glue synthesis, preparation of resin-based electrical insulation and thermal conductive composite dielectric materials, high-temperature hot pressing molding process of thermal conductive copper clad laminate and many other issues of concern to the industry.
In terms of new materials for high-frequency copper clad laminates, the papers of Dr. Ceng Ming of China University of Geosciences, "Preparation and Performance Research of Low Dielectric Main Chain Benzoxazine Resin" and "Low Dielectric Polycarbosilane High-frequency Copper Clad Laminate Materials" by Professor Yang of Southwest University of Science and Technology, introduced new materials with Dk reaching 2.4 grade.
The paper "Preparation of Surface Activated Graphene and Its Application in Polyimide" by Wang Dan, a graduate student of Jianghan University, is the first literature on the application of graphene in the field of copper clad laminate raw materials published in previous seminars.
Professor Li Wenfeng of Tongji University, "Research on the Reaction Mechanism of Cyanate Ester/Hydroxyl", is considered by relevant experts that the research on the reaction mechanism of cyanate ester/hydroxyl is in-depth and unique, and it is very likely to play an important supporting and guiding role in related research.
The paper of Hu Qibin, engineer of the National Electronic Circuit Substrate Engineering Technology Research Center, "Preparation and Performance Research of Glue-free Double-sided Flexible Copper Clad Laminate", introduces the successful process of manufacturing two-layer flexible copper plate by secondary coating method.
The paper "Development of Transparent Flexible PET Substrate and Covering Film" by Xu Yaxin, an engineer of Guangzhou Hongren Electronic Industry Co., Ltd., is a rare document in previous seminars that introduces the manufacturing process of another large class of polyester flexible copper clad laminate and related products.
In the paper "Research on Electroless Nickel Plating on Epoxy Resin Surface" by Hu Zhiqiang of Chengdu University of Electronic Science and Technology, the effects of main salt concentration, reducing agent concentration, plating temperature and plating solution pH on electroless nickel deposition rate are explored for electroless nickel plating on epoxy resin surface, which has important applications in electromagnetic shielding and embedded resistor production, and the optimal parameters are obtained.
Shandong Jinbao Electronics Co., Ltd. Yang Xiangkui's paper "Research on Surface Fine Treatment Technology of Copper Foil for High Frequency Circuits", for the first time in previous seminars, introduced in detail the HTE-LC electrolytic copper foil manufacturing process, which is very suitable for high temperature, high elongation and low roughening treatment for high frequency printed circuits such as polytetrafluoroethylene, ceramic filled hydrocarbons and polyphenylene ether. It marks the great progress of domestic copper foil in high frequency circuit copper foil.
In a word, the papers of this seminar not only involve a wide range of professional fields, but also have many highlights. Participants generally reflected that this was a rare opportunity to obtain a large amount of innovative information and benefited a lot.
The co-organizers of this seminar are: China Electronic Materials Industry Association Electronic Fine Chemicals and Polymer Materials Branch, China Electronic Materials Industry Association Electronic Copper Foil Materials Branch (CCFA), Guangdong Circuit Board Industry Association (GPCA), Shenzhen Circuit Board Industry Association (SPCA), Taiwan Circuit Board Association (TPCA), China Flexible Copper Clad Laminate Enterprise Association. This seminar was also sponsored by Shanghai South Asia Copper Foil Plate Co., Ltd., Shaanxi Shengyi Technology Co., Ltd., Xianyang Weidi Electromechanical Technology Co., Ltd., Shandong Shengquan New Materials Co., Ltd., Guangdong Shengyi Technology Co., Ltd., Linzhou Guangyuan New Materials Technology Co., Ltd., Guangdong Tongyu New Materials Co., Ltd., Zhuhai Zhendong Co., Ltd., Nantong Tuhai Machinery Co., Ltd., and Shanghai Jiyong Industry and Trade Co., Ltd. The organizing committee and all representatives express their heartfelt thanks to all co-organizers and sponsors for their strong support!