20thOneChina Copper Clad Laminate Technology Seminar

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China Electronic Materials Industry Association Copper Clad Laminate Materials Branch and China Electronic Circuit Industry Association Copper Clad Laminate Branch are scheduled to hold the "21st China Copper Clad Laminate Technology Seminar" at "Lingnan Oriental Hotel" in Sihui City, Guangdong Province from November 28 to November 30, 2020 ".

The theme of this seminar is "increasing technological innovation to overcome difficulties and achieve stability". This conference is held under the situation that the global economic situation is still complex and severe, and the development of copper clad laminate industry and the uncertainty of market pattern are increasing. This situation also brings new opportunities to China's copper clad laminate industry to speed up the pace of high-end technological breakthroughs and to open up new markets under product upgrading. This seminar focuses on the new progress of technological innovation, exchanges the new trend of market demand, and shows the new achievements of raw materials and equipment for copper clad laminate, which is of great significance to promote the healthy development of the industrial chain.

Since the establishment of CCLA in 2000 and the annual "China Copper Clad Laminate Technology Seminar", it has become the highest-end technology exchange event in China's copper clad laminate manufacturing industry. This conference will invite many experts from the copper clad laminate industry and its upstream and downstream industries to make a wonderful report on the hot topics of CCL technology and market. There are also excellent papers presented by experts and technicians from the domestic copper clad laminate industry and upstream and downstream industries. During the conference, the "CCLA Cup Excellent Paper Award" of this seminar was grandly awarded, and representatives were organized to visit the organizer.

Warmly welcome copper clad laminate industry and upstream and downstream business representatives, the industry will visit.

Warmly welcome people from all walks of life and institutions concerned about the development of copper clad laminate industry to visit this event.

Delegates to the conference must abide by the relevant provisions of the government of the place where the conference is held.

Organizer and Contact Information:

China Electronic Materials Industry Association Copper Clad Laminate Materials Branch Wang Xiaoyan:029-33335234

Li Qiong, Copper Clad Laminate Branch of China Electronic Circuit Industry Association:021-54179011-605

Undertaker:

Guangdong Tongyu New Material Co., Ltd

Co-organizers:

China Electronic Materials Industry Association Electronic Copper Foil Material Branch (CCFA)

Guangdong Circuit Board Industry Association (GPCA)

Shenzhen Circuit Board Industry Association (SPCA)

Hunan Electronic Circuit Industry Association (HNPCA)

Taiwan Circuit Board Association (TPCA)

Sponsor:

Nanya New Materials Technology Co., Ltd. Shandong Shengquan New Materials Co., Ltd.

Nord Investment Co., Ltd. Zhejiang Huazheng New Materials Co., Ltd.

Guangdong Shengyi Technology Co., Ltd. Jiantou Laminated Board Holding Co., Ltd.

Nantong Kaidi Automatic Machinery Co., Ltd. Jiangsu Hangao Technology Co., Ltd.

Suzhou Jufeng New Material Technology Co., Ltd.

Nantong Tuhai Machinery Co., Ltd. Xi'an Yuchang Environmental Technology Co., Ltd.

Zhuhai Zhendong Co., Ltd. Guangdong Inspeck Vision Technology Co., Ltd.

Guangzhou Junliang Mould Technology Co., Ltd. Hongan (Fujian) Machinery Co., Ltd.

Wuxi Altai Steel Co., Ltd. American Microvision Detection Technology Company

Meizhou Weilibang Electronic Technology Co., Ltd. Xianyang Weidi Electromechanical Technology Co., Ltd.

Shaanxi Baoyu Technology Industry Co., Ltd. Jiangxi Chenguang New Material Co., Ltd.

Sponsor solicitation • • • • • •

Meeting schedule:

"The 21st China Copper Clad Laminate Technology Seminar": November 28-30, 2020. Report all day on November 28, report all day on November 29 (8:30~18:00), visit Guangdong tongyu new materials co., ltd. and sihui city electronic information industrial park from 8:20 a.m. to 12:00 a.m. on November 30, and evacuate in the afternoon. The details of the 29 November report are attached.

Payment Method:

Account: China Electronic Materials Industry Association

Bank: ICBC Beijing Xiangheyuan Sub-branch

Account number: 0200 0191 0900 0125 724

Note: For advance remittance, please send the invoicing information together with the meeting receipt to the conference group on the date of remittance. After receiving the remittance, the invoice can be mailed. Please add "CCL conference fee" to distinguish the remittance. For on-site cash payment, please send the invoicing information together with the meeting receipt to the conference group in advance so as to make out the invoice in time.

Meeting Address:

Lingnan Oriental Hotel, Sihui City (33 Zhenshan Avenue, Sihui City, Guangdong Province)

Hotel Tel:0758-3118888

conference hotel traffic guide:

Plane: Guangzhou Baiyun International Airport is about 65 kilometers away from the conference hotel, and it takes about 70 minutes to reach the hotel by car.

High-speed rail: Zhaoqing East Station is about 13 kilometers away from the conference hotel and takes about 30 minutes to reach the hotel by car.

Self-driving: Guangdong-Guangzhou Expressway to Guangfo-Zhao Expressway to Lotus Exit, exit to the hotel for about 10 minutes.

Note: The organizer of this meeting provides shuttle service. The shuttle service schedule is as follows:

Pick-up time: November 28, from 12:00 to 24:00, Guangzhou Baiyun International Airport and Zhaoqing East Station will take the delegates to the hotel every two hours.

Delivery time: November 30, 8:00/10:00 and 13:30/16:00, two buses will be arranged to send delegates to Guangzhou Baiyun International Airport and Zhaoqing East Station.

Please arrange the travel time reasonably.

Meeting group contact:

Contact: Wang Xiaoyan:13609146084,029-33335234,13369111960

Dong Bang Banner:15667263899

Association of WeChat:15667246308

　　E-mail：ccla33335234@163.com

Website:www.chinaccl.cn

Organizing Committee of the 21st China Copper Clad Laminate Technology Seminar

9 November 2020

The 21st China Copper Clad Laminate Technology Symposium

Meeting Receipt

Meeting schedule for November 29, 2020 (tentative)

From 8:30 a.m. to 12:00 a.m. on November 30, visit "Guangdong tongyu new materials co., ltd." and "sihui city electronic information industrial park".